Patented hybrid rework technology (combination of IR heating technology and convection) for safe desoldering and soldering Optimum energy transfer and gentle heating of chip components 0201 up to 20 x 20 mm SMDs Exchangeable hybrid adaptors of various sizes direct up to 200 W of heating energy specifically to the component No blowing away of neighbouring components Optionally available with stand, 800 W IR bottom heating and PCB intake Vac Pen for safe handling of devices Operation software IRSoft